Over the last few years, wireless data traffic has drastically increased due to a change in the way today’s society creates, shares and consumes information. In parallel to the massive growth in the total number of mobile connected devices, there has been an increasing demand for higher speed wireless communication anywhere, anytime. Wireless data rates have doubled every eighteen months for the last three decades. Following this trend, Terabit-per-second (Tbps) links will become a reality within the next five years.

In this context, Terahertz (THz)-band (0.1–10 THz) communication is envisioned as a key wireless technology to satisfy such demand. This frequency band, which lies in between millimeter-waves and the far infrared, remains still one of the least explored regions in the EM spectrum. For many decades, the lack of compact high-power signal sources and high-sensitivity detectors able to work at room temperature has hampered the use of the THz band for any application beyond sensing. However, many recent advancements with different electronic, photonic and plasmonic technologies is finally closing the so-called THz gap.

THz-band communication brings many new opportunities to the wireless communication community. The THz band supports huge transmission bandwidths, which range from almost 10 THz for distances below one meter, to multiple transmission windows with bandwidth of tens to hundreds of GHz, for distances in the order of a few tens of meters. The THz band opens the door to a plethora of applications in very diverse domains, ranging from Terabit Wireless Personal and Local Area Networks to Wireless Nanosensor Networks or the Internet of Nano-Things. Nevertheless, there are many challenges from the device, communication and networking perspectives, which require fundamentally new solutions.

The First IEEE International Workshop on Terahertz Band Communication Networks (TBCN) will be held in Shanghai, China, on May 20 (afternoon) 2019, in conjunction with the IEEE International Conference on Communications (ICC). The twofold mission of this workshop is to increase the visibility of THz communications and to bring together researchers from diverse disciplines that can foster and develop this very fast developing field. The workshop aims to attract researchers and academics from various fields of study, ranging from THz materials, devices and packaging, to THz communication and networking researchers.

Call for Papers

We seek original completed and unpublished work not currently under review by any other journal/magazine/conference. Topics of interest include, but are not limited to:

  • Transceivers for TBCNs
  • Antenna and antenna arrays for TBCNs
  • Information theoretic analysis of TBCNs
  • Channel models for TBCNs
  • Channel estimation techniques for TBCNs
  • Ultra-broadband modulation and waveform design for TBCNs
  • Beamforming, precoding and space-time coding schemes for TBCNs
  • MAC layer design for TBCNs
  • Interference management for TBCNs
  • Relaying and routing in TBCNs
  • End-to-end Performance Models for TBCNs
  • System-level modeling and experimental demonstrations for TBCNs
The workshop will feature a keynote speech together with presentations of accepted papers.

Important Dates

   Paper submission deadline:   January 25, 2019 February 2, 2019
   Notification of acceptance:     February 22, 2019 March 7, 2019
   Camera-ready papers due:    March 16, 2019

Organizing Committee

General Chairs

Ian F. Akyildiz, Georgia Institute of Technology, USA
Zhi Chen, University of Electronic Science and Technology, China
Dan Mittleman, Brown University, USA

Technical Program Committee Chairs

Wolfgang Gerstacker, Friedrich-Alexander University of Erlangen-Nuremberg, Germany
Chong Han, Shanghai Jiao Tong University, China
Josep M. Jornet, University at Buffalo, The State University of New York, USA

Technical Program Committee

Sergi Abadal, Universitat Politècnica de Catalunya (UPC), Spain
Angeliki Alexiou, University of Piraeus, Greece
Alan Davy, Waterford Institute of Technology, Ireland
Guillaume Ducournau, IEMN - Lille University, France
Juan Sebastián Gomez-Diaz, University of California, Davis, USA
Ke Guan, Beijing Jiaotong University, P.R. China
Mahbub Hassan, University of New South Wales, Australia
Biaobing Jin, Nanjing University, P.R. China
Markku Juntti, University of Oulu, Finland
Thomas Kürner, Technische Universität Braunschweig, Germany
Christos Liaskos, Institute of Computer Science, Foundation of Research and Technology, Hellas, Greece
Imran Mehdi, NASA Jet Propulsion Laboratory, USA
Tadao Nagatsuma, Osaka University, Japan
Kaushik Sengupta, Princeton University, USA
Suresh Singh, Portland State University, USA
Ho-Jin Song, POSTECH, Korea
Xin-Wei Yao, Zhejiang University of Technology, P.R. China
Xianbin Yu, Zhejiang University, P.R. China
Yaxin Zhang, University of Electronic Science and Technology of China, P.R. China
Herbert Zirath, Chalmers University of Technology, Sweden

Paper Submission

The workshop accepts only novel, previously unpublished papers. All submissions should be written in English with a maximum paper length of six (6) printed pages (10-point font) including figures without incurring additional page charges (maximum 1 additional page with over-length page charge if accepted). For more information, please see IEEE ICC 2019 official website.

All papers should be submitted using EDAS, using this link.

Participant Registration

Participants should register according to the IEEE ICC 2019 guidelines.
More information can be found here.

Workshop Venue

The conference hotel is the Oriental Riverside Hotel. More details on the conference venue, accommodation, transportation and logistics can be found here.

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